WEKA Graduate – Open Standard Module (OSM)
Konferenzzentrum München, Lazarettstraße 33, 80636 Munich
November 6, 2023

The workshop on November 7, 2023 is canceled.

OSM – overview and baseboard design

In the workshop “OSM – overview and baseboard design” from WEKA Fachmedien, participants will learn everything about the new solder-on-module-standard Open Standard Module (OSM). It has been developed from the Standardization Group for embedded Technologies (SGeT) three years ago. Currently, there are four different sizes of OSM modules – in our morning session all basics about the standard will be explained. Additionally, questions like “Which things do I need, before I can start my first OSM project?” will be covered.

In the afternoon sessions the participants will learn everything about hardware and software development and can design their own OSM baseboard. We inform about the subtleties of OSM, differences and similarities of the modules, the power supply, and possible obstacles. At the end of the workshop, attendees will receive a confirmation of participation. In addition, the WEKA Graduate Program offers the possibility of a certificate. Simply complete a short comprehension test and if further seminars are attended the certificate can be extended.

The seminar is aimed at developers of embedded hardware as well as decision makers for industrial computer technology.


The evolution of modular embedded computing (AM)
Computer-on-Modules: Why another standard?
Form factors: overview, comparison, advantages & disadvantages
COM-Standards: solder down vs. pin on

Deep dive into the OSM standard (AM)
General information about OSM
Specification: review, highlights, do‘s and dont‘s
Design Guide: review, highlights, do‘s and dont‘s
SGeT insights: latest trends & developments within OSM
Overview about OSM product portfolio

Hardware session (PM)
Differences and similarities of OSM modules
OSM Baseboard Design:
How to design a baseboard, what to know and consider in advance, possible obstacles
Power supply, PCIe and USB 3.0

Software session (PM)
Get Software started with OSM Hardware
Set up an OSM evaluation environment
Make the Software application running (Arm, x86)

How to start and evaluate an OSM project (PM)
Things to check in advance
How to create and evaluate the framework
Creating a new OSM project – example

Questions to be covered:

  • Which challenges do I have to overcome by designing an OSM module or baseboard?

  • Which things do I need, before I can start my first OSM project?

  • What do I need to consider, when designing a baseboard?

  • Which software do I need and how can I make it run on my baseboard?

  • Which design guidelines for OSM are written down and how can I use it?


Martin Steger, after successfully completing his studies in electrical engineering at RWTH Aachen University, has been involved in embedded computer technology since 1997. First, he was focusing on the conceptual design and sales of complex and modular system solutions – initially as a team member since April 2000 and as managing partner of the company iesy since October 2008. Martin Steger is considered a driving force in various standardization topics and has been a board member of SGET since 2018. As chairman of the standardization groups »Open Standard Module« and »embedded NUC«, he helps to set milestones for the entire industry. His work was honored by the magazine »Markt & Technik« three years in a row and Martin Steger was named »Manager of the Year« in 2015, 2016 and 2017. As a passionate entrepreneur, he invests a lot of time and personality in the iesy 2.0 project – the ongoing drive for innovation and change that is anchored in the company DNA. Martin Steger actively drives this change to continuously develop the company iesy with it‘s 55-year company history.

Martin Stelter has been working for iesy as project manager for hardware and development since July 2020. He has special experience in the field of embedded Arm modules based on i.MX6, i.MX7 and i.MX8 processors. At iesy, he is responsible for technical projects, product qualifications, technical concepts, and specifications.